New Materials Target Interconnect Performance and On-Chip Photonics
• New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals high-pressure hexagonal GeSn alloys.
Interconnect
Keysight Launches 3D Interconnect Designer for Chiplets and 3DICs
• The W3510E workflow targets pre-layout modeling, EM analysis, and early UCIe and BoW validation for advanced AI infrastructure designs. • The W3510E workflow targets pre-layout m
Software accelerates 3D interconnect design
• The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages. • By removing time-consuming manual steps, the tool
Keysight adds 3D interconnect design tool to EDA suite
• New software targets chiplet and 3DIC packaging, modeling complex geometries and streamlining multi-die workflows. • Keysight Technologies introduced 3D Interconnect Designer as
Bull Accelerates Innovation with New High-Speed Interconnect Investment
• NewsAI NewsBusiness of HPCNew Installations AI News Business of HPC New Installations HPC-AI HardwareComputeCPUs, GPUs, FPGAsExascaleFuture TechnologyGreen HPCHPC/AI Chips and Sy
Device enables direct communication among multiple quantum processors
• MIT researchers created a superconducting interconnect enabling direct communication among multiple quantum processors. • The device supports scalable all‑to‑all connectivity, el