• New software targets chiplet and 3DIC packaging, modeling complex geometries and streamlining multi-die workflows. • Keysight Technologies introduced 3D Interconnect Designer as a new addition to its electronic design automation (EDA) portfolio. • The tool is intended to support the design of 3D interconnects for chiplet-based and 3DIC advanced packages used in AI infrastructure and data center applications. • As chiplet architectures gain adoption, engineers are working with increasingly complex 3D interconnect designs for multi-die and stacked-die applications and many traditional workflows do not handle these designs efficiently. • Teams often spend substantial time manually optimizing interconnect elements such as vias, transmission lines, solder balls and micro-bumps while maintaining signal and power integrity in dense systems. • This can lead to additional design iterations and longer development cycles, which can delay product launches and increase development costs.
Article Summaries:
- Keysight Technologies has added a 3D Interconnect Designer to its electronic design automation (EDA) portfolio. The new tool targets chiplet‑based and 3D integrated circuit (3DIC) packaging, enabling engineers to model complex geometries-such as hatched or waffled ground planes-and automate the design of interconnect elements like vias, transmission lines, solder balls, and micro‑bumps. By integrating with existing Keysight EDA products and supporting standards such as UCIe and BoW, the software aims to reduce manual optimization, lower compliance risk, and shorten development cycles for AI and data‑center applications.
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