Interconnect on Tenu Tech Brief

Interconnect on Tenu Tech Brief https://cluster-site.onrender.com/tags/interconnect/ Recent content in Interconnect on Tenu Tech Brief Hugo -- 0.146.0 en-us Wed, 25 Feb 2026 07:59:14 +0000 New Materials Target Interconnect Performance and On-Chip Photonics https://cluster-site.onrender.com/posts/new-materials-target-interconnect-performance-and-on-chip-photonics/ Wed, 25 Feb 2026 06:45:42 +0000 https://cluster-site.onrender.com/posts/new-materials-target-interconnect-performance-and-on-chip-photonics/ • New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals high-pressure hexagonal GeSn alloys. Keysight Launches 3D Interconnect Designer for Chiplets and 3DICs https://cluster-site.onrender.com/posts/keysight-launches-3d-interconnect-designer-for-chiplets-and-3dics/ Tue, 24 Feb 2026 00:40:06 +0000 https://cluster-site.onrender.com/posts/keysight-launches-3d-interconnect-designer-for-chiplets-and-3dics/ • The W3510E workflow targets pre-layout modeling, EM analysis, and early UCIe and BoW validation for advanced AI infrastructure designs. • The W3510E workflow targets pre-layout m Software accelerates 3D interconnect design https://cluster-site.onrender.com/posts/software-accelerates-3d-interconnect-design/ Thu, 19 Feb 2026 16:27:14 +0000 https://cluster-site.onrender.com/posts/software-accelerates-3d-interconnect-design/ • The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages. • By removing time-consuming manual steps, the tool Keysight adds 3D interconnect design tool to EDA suite https://cluster-site.onrender.com/posts/keysight-adds-3d-interconnect-design-tool-to-eda-suite/ Thu, 19 Feb 2026 12:12:19 +0000 https://cluster-site.onrender.com/posts/keysight-adds-3d-interconnect-design-tool-to-eda-suite/ • New software targets chiplet and 3DIC packaging, modeling complex geometries and streamlining multi-die workflows. • Keysight Technologies introduced 3D Interconnect Designer as Bull Accelerates Innovation with New High-Speed Interconnect Investment https://cluster-site.onrender.com/posts/bull-accelerates-innovation-with-new-high-speed-interconnect-investment/ Thu, 12 Feb 2026 20:19:58 +0000 https://cluster-site.onrender.com/posts/bull-accelerates-innovation-with-new-high-speed-interconnect-investment/ • NewsAI NewsBusiness of HPCNew Installations AI News Business of HPC New Installations HPC-AI HardwareComputeCPUs, GPUs, FPGAsExascaleFuture TechnologyGreen HPCHPC/AI Chips and Sy Device enables direct communication among multiple quantum processors https://cluster-site.onrender.com/posts/device-enables-direct-communication-among-multiple-quantum-processors/ Fri, 21 Mar 2025 10:00:00 +0000 https://cluster-site.onrender.com/posts/device-enables-direct-communication-among-multiple-quantum-processors/ • MIT researchers created a superconducting interconnect enabling direct communication among multiple quantum processors. • The device supports scalable all‑to‑all connectivity, el