• The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages. • By removing time-consuming manual steps, the tool streamlines the optimization of complex interconnect structures-including vias, transmission lines, solder balls, and micro-bumps-while ensuring signal and power integrity in densely packed systems. • Part of Keysight’s EDA portfolio, the software provides a pre-layout workflow for advanced multi-die integration, UCIe compliance, automated routing, and robust simulation capabilities. • It handles complex geometries-including hatched or waffled ground planes-that are critical for addressing manufacturing and fabrication constraints, particularly in silicon interposers and bridges. • The software can operate independently or alongside Keysight’s other EDA tools, enabling teams to seamlessly incorporate 3D interconnect workflows into their existing design environments. • To learn more about the Keysight Chiplet 3D Interconnect Designer (W3510E) and request a quote, visit the product page linked below.

Article Summaries:

  • The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages. By removing time-consuming manual steps, the tool streamlines the optimization of complex interconnect structures-including vias, transmission lines, solder balls, and micro-bumps-while ensuring signal and power integrity in densely packed systems. Part of Keysight’s EDA portfolio, the software provides a pre-layout workflow for advanced multi-die integration, UCIe compliance, automated routing, and robust simulation capabilities. It handles complex geometries-includin

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