New Materials Target Interconnect Performance and On-Chip Photonics
• New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals high-pressure hexagonal GeSn alloys.
• New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals high-pressure hexagonal GeSn alloys.
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• Abstract Telecommunication systems are evolving towards ultrawide bandwidth and low latency, supporting wired and wireless links and their non-blocking interconnection1. • Howeve
Quantonation Ventures closes €220M second fund, surpassing €200M target and becoming largest quantum investment vehicle. Fund size doubles first €91M fund, signaling shift from ear
• Single-step thermal process produces high-density, narrowband quantum emitters in hexagonal boron nitride. • Emitters exhibit narrow spectral linewidths, ideal for single-photon
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• In this interview, Elisenda Lara, EPIC’s MarCom Manager, talks with Laura Horan, Staff Engineer and Head of Product Management at Vanguard Automation, about how young people can
• Breadcrumb MIT News The high-tech wizardry of integrated photonics The high-tech wizardry of integrated photonics Press Contact: Media Download *Terms of Use: Images for download