• Home Systems & Design Low Power - High Performance Manufacturing, Packaging & Materials Test, Measurement & Analytics Auto, Security & Enabling Technologies Special Reports Business & Startups Jobs Knowledge Center Technical PapersHome’;AI/ML/DLArchitecturesAutomotive/ AerospaceCommunication/Data MovementDesign & VerificationLithographyManufacturingMaterialsMemoryOptoelectronics / PhotonicsPackagingPower & PerformanceQuantumSecurityTest, Measurement, Analytics tech papersTransistorsZ-End Applications Home AI/ML/DL Architectures Automotive/ Aerospace Communication/Data Movement Design & Verification Lithography Manufacturing Materials Memory Optoelectronics / Photonics Packaging Power & Performance Quantum Security Test, Measurement, Analytics tech papers Transistors Z-End Applications Events & WebinarsEventsWebinars Events Webinars Videos & ResearchVideosIndustry Research Videos Industry Research Newsletters & StoreNewslettersStore Newsletters Store MENUHomeSpecial ReportsSystems & DesignLow Power-High PerformanceManufacturing, Packaging & MaterialsTest, Measurement & AnalyticsAuto, Security & Enabling TechnologiesKnowledge CenterVideosStartup CornerBusiness & StartupsJobsTechnical PapersEventsWebinarsIndustry ResearchNewslettersStoreSpecial Reports Home Special Reports Systems & Design Low Power-High Performance Manufacturing, Packaging & Materials Test, Measurement & Analytics Auto, Security & Enabling Technologies Knowledge Center Videos Startup Corner Business & Startups Jobs Technical Papers Events Webinars Industry Research Newsletters Store Special Reports Leading At Light Speed: What Makes Photonics Leadership Different Teams must make decisions now about technologies that won’t mature for years. • By Jan-Bart Smits and David Harap Every time a transistor switches, it generates heat. • Pack enough transistors together and you hit a wall: the chip melts before it computes. • This thermal ceiling is whySplunk notesthat “as physical and economic limitations are reach

Article Summaries:

  • Summary

Photonic technology is reshaping the semiconductor industry as heat limits of transistor scaling push firms toward light‑based interconnects. Silicon’s indirect bandgap forces the use of III‑V materials (InP, GaAs), creating a heterogeneous‑integration challenge that doubles technical complexity and supply‑chain risk. In the U.S., Intel has shipped millions of photonic chips, while NVIDIA’s 2025 GB300 AI processors will use TSMC‑Broadcom co‑packaged optics-an architectural choice that could set the industry standard. Europe is consolidating through acquisitions and new units like ZEISS’s €200 million business, whereas China is pursuing self‑reliance with 6‑inch lithium‑niobate wafers amid export controls. Asia‑Pacific partners-Japan, Taiwan, India-are investing billions in joint R&D. Market forecasts range from $1.1 to 2.4 trillion by 2030, underscoring the high capital stakes and long development cycles.

Sources: