Packaging

Staying Ahead of Packaging and Plastics Regulations with AI-Driven Capabilities: New Updates to SAP Responsible Design and Production

• With the rapid expansion of regulations concerning packaging and packaging waste, such as the extended producer responsibility (EPR), and plastic taxes, organizations face the pr

Siemens wins packaging design award at Chiplet Summit

• Innovator3D IC supports 2.5D and 3D integration of ASICs and chiplets within a unified system-level design flow. • Siemens has won in the ‘Packaging: Design’ category at the 2026

Community Refines Git Packaging Workflow

• Community Refines Git Packaging Workflow 19. • Feb 2026 | Douglas DeMaio | CC-BY-SA-3.0 Contributors and developers within openSUSE Project recently met to coordinate the Git-bas