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    <title>Packaging on Tenu Tech Brief</title>
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    <description>Recent content in Packaging on Tenu Tech Brief</description>
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      <title>Staying Ahead of Packaging and Plastics Regulations with AI-Driven Capabilities: New Updates to SAP Responsible Design and Production</title>
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      <pubDate>Wed, 25 Feb 2026 13:15:00 +0000</pubDate>
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      <description>• With the rapid expansion of regulations concerning packaging and packaging waste, such as the extended producer responsibility (EPR), and plastic taxes, organizations face the pr</description>
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      <title>Siemens wins packaging design award at Chiplet Summit</title>
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      <pubDate>Mon, 23 Feb 2026 11:32:52 +0000</pubDate>
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      <description>• Innovator3D IC supports 2.5D and 3D integration of ASICs and chiplets within a unified system-level design flow. • Siemens has won in the &amp;lsquo;Packaging: Design&amp;rsquo; category at the 2026</description>
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      <title>Community Refines Git Packaging Workflow</title>
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      <pubDate>Thu, 19 Feb 2026 16:00:00 +0000</pubDate>
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      <description>• Community Refines Git Packaging Workflow 19. • Feb 2026 | Douglas DeMaio | CC-BY-SA-3.0 Contributors and developers within openSUSE Project recently met to coordinate the Git-bas</description>
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