• Siemens wins the “Packaging: Design” award at the 2026 Chiplet Summit Best of Show. • Innovator3D IC enables fast, predictable pathfinding for ASIC and chiplet integration across complex systems. • It supports advanced 2.5D and 3D packaging technologies, delivering heterogeneous integration solutions. • The award was presented at Santa Clara Convention Center during the fourth annual Chiplet Summit. • Chiplet Summit is the largest industry event for chiplet-based processors, memories, and AI devices. • Innovator3D IC offers a unified design flow for ASICs and chiplets across multiple substrates. • Siemens demonstrates leadership in semiconductor packaging innovation, advancing 2.5D and 3D technologies.

Article Summaries:

  • Siemens received the “Packaging: Design” award at the 2026 Chiplet Summit Best‑of‑Show Awards for its Innovator3D IC solution. The award was presented at the Santa Clara Convention Center during the fourth annual Chiplet Summit, the industry’s largest event focused on chiplet technology for processors, memories, communications chips and AI devices. Innovator3D IC offers a unified design flow that supports 2.5D and 3D integration of ASICs and chiplets, delivering fast, predictable pathfinding, planning and heterogeneous packaging. More details are available on Siemens’ website.

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