Renesas Looks to the Future of Automotive With New Memory and SoC Tech
• The company attended ISSCC with some big automotive announcements: a new approach to chiplet-based processing and a configurable 3-nm memory architecture.
Renesas
SPAD Imaging, Renesas 3-nm TCAM Technology, LoRa Alliance 2025 Report: Embedded Week Insights
• Here’s a roundup of this week’s must-read articles. • We’ll delve into the latest developments on SPAD Imaging, Renesas 3-nm TCAM Technology, and LoRa Alliance 2025 Report! • Als
SPAD Imaging, Renesas 3nm TCAM Technology, LoRa Alliance 2025 Report: Embedded Week Insights
• Here’s a RoundUp of this week’s must-read articles - we’ll delve into the latest developments on SPAD Imaging, Renesas 3nm TCAM Technology, and LoRa Alliance 2025 Report! • Also,
Renesas Demonstrates Configurable 3-nm TCAM
• Renesas Electronics Corporation has announced the development of a configurable ternary content-addressable memory (TCAM) implemented using a 3-nm FinFET manufacturing process. •
Renesas Demonstrates Configurable 3nm TCAM
• Renesas Electronics Corporation has announced the development of a configurable ternary content-addressable memory (TCAM) implemented using a 3 nm FinFET manufacturing process. •
Renesas Advances 3-nm Automotive SoC Technologies
• Renesas Electronics Corporation has developed three system-on-chip (SoC) technologies aimed at automotive multi-domain electronic control units (ECUs), combining AI acceleration,