• Here’s a RoundUp of this week’s must-read articles - we’ll delve into the latest developments on SPAD Imaging, Renesas 3nm TCAM Technology, and LoRa Alliance 2025 Report! • Also, check News Archives - Embedded and Technical Articles Archives - Embedded for the complete list of news and articles from our website. • NEWS LoRa Alliance 2025 Report Highlights LoRaWAN Growth LoRaWAN reached 125M devices globally in 2025, with growth in utilities, smart buildings, and satellite connectivity. • Microchip, Hyundai Partner on 10BASE-T1S SPE The partnership explores 10BASE-T1S SPE to simplify in-vehicle networks, reduce wiring complexity, and support next-generation automotive architectures. • Laser driver ICs cut power losses by 70% Silanna’s SL2001 and SL2002 laser firing system ICs for LiDAR and rangefinders are now available in production quantities. • Tasking Announces Integrated Embedded Software Toolchain Tasking’s integrated toolchain streamlines safety- and security-critical embedded development and multicore analysis.
Article Summaries:
- Embedded Week highlights several key advances across the embedded ecosystem. The LoRa Alliance 2025 report notes a global reach of 125 million LoRaWAN devices, driven by utilities, smart‑building, and satellite use cases. Microchip and Hyundai are collaborating on a 10BASE‑T1S SPE solution to reduce wiring complexity in next‑generation automotive networks. Silanna’s new SL2001/SL2002 laser driver ICs cut LiDAR power losses by 70 %. Tasking unveiled an integrated software toolchain that streamlines safety‑critical and multicore development. Renesas showcased a configurable 3 nm TCAM architecture and a new automotive SoC platform featuring AI acceleration, chiplet safety, and advanced power management, while SPAD imaging is being adopted to enhance perception in industrial robotics.
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