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Designing the Future: AI-Driven Multi-Die Innovation in the Era of Agentic Engineering

Designing the Future: AI-Driven Multi-Die Innovation in the Era of Agentic Engineering

• At the 2026 Chiplet Summit, Synopsys presented a bold vision for the future of semiconductor innovation: AI-driven multi-die design powered by agentic intelligence • As the semic

Accelerating Static ESD Simulation for Full-Chip and Multi-Die Designs with Synopsys PathFinder-SC

Accelerating Static ESD Simulation for Full-Chip and Multi-Die Designs with Synopsys PathFinder-SC

• As analog and mixed-signal designs become increasingly complex, parasitic effects dominate both design time and cost, consuming 30-50% of engineers’ effort in debugging and reana