Siemens wins packaging design award at Chiplet Summit
• Innovator3D IC supports 2.5D and 3D integration of ASICs and chiplets within a unified system-level design flow. • Siemens has won in the ‘Packaging: Design’ category at the 2026
Chiplet
Emerging Chiplet Designs Spark Fresh Cybersecurity Challenges
• As scaled-down circuits with limited functions redefine computing for AI systems and autonomous vehicles, their flexibility demands new approaches to safeguard critical infrastru