• Efficient heat dissipation is critical in fan-out packages. • As chip performance and integration continue to advance, thermal dissipation control has become increasingly critical not only at the wafer fabrication level but also in the packaging industry. • For artificial intelligence (AI) and high performance computing (HPC) applications, the industry is gradually shifting toward 2.5D integration. • In response to the growing demand, High-Density Fan-Out (HDFO) packaging has emerged as a key solution. • Consequently, the need to enhance the thermal dissipation performance of fan-out packages has also increased. • In particular, the S-SWIFT package is designed to accommodate high-performance chips with increased integration density.
Article Summaries:
- The article discusses the growing need for efficient heat dissipation in high‑density fan‑out (HDFO) and S‑SWIFT packages used in AI and HPC. Conventional backside metallization (BSM) processes, which rely on high‑temperature aluminum spiking, are incompatible with the low glass‑transition temperatures of fan‑out epoxy molding compounds. The study proposes low‑temperature BSM alternatives that avoid high‑temperature steps while still enabling reliable solder‑TIM integration. It evaluates the thermal performance of these new BSM structures, reviews their advantages and limitations for S‑SWIFT, and summarizes an implementation sequence that meets the unique structural and reliability requirements of fan‑out packages.
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