• Empower has launched three embedded silicon capacitors (ECAPs) for AI and high-performance computing (HPC) processors. • The portfolio includes the EC2005P (9.34 μF in a 2×2-mm package), EC2025P (18.68 μF in a 4×2-mm package), and EC2006P (36.8 μF in a 4×4-mm package). • These components are designed for integration into processor substrates to support elevated current density and fast transient load demands. • As AI and HPC workloads increase, conventional board-mounted capacitors struggle to maintain low impedance and fast response. • These ECAP devices provide high capacitance density with ultralow equivalent series inductance (ESL) and resistance (ESR), improving power delivery network (PDN) performance when embedded close to the die. • Tight dimensional tolerances ensure compatibility with advanced packaging flows.

Article Summaries:

  • Empower has launched three embedded silicon capacitors (ECAPs) for AI and high-performance computing (HPC) processors. The portfolio includes the EC2005P (9.34 μF in a 2×2-mm package), EC2025P (18.68 μF in a 4×2-mm package), and EC2006P (36.8 μF in a 4×4-mm package). These components are designed for integration into processor substrates to support elevated current density and fast transient load demands. As AI and HPC workloads increase, conventional board-mounted capacitors struggle to maintain low impedance and fast response. These ECAP devices provide high capacitance density with ultralow

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