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Article Summaries:

  • Chip Industry Week in Review

The IEEE ISSCC conference in San Francisco highlighted major funding announcements-$50 million for agentic AI, deals for Analog Devices, Cadence, Nordson, Nova, and Onto Innovation-and new research tools such as a 3D interconnects analyzer and Ultra Ethernet security suite. Intel‑Google stress tests exposed vulnerabilities in Intel’s Trust Domain Extensions, prompting rapid remediation. Niobium and Semifive announced a fully homomorphic encryption accelerator, while Keysight unveiled GDDR7 compliance and real‑time oscilloscopes. Advances in packaging included laser arrays for co‑packaged optics, and EPFL researchers presented a heat‑backflow model for thermal management. The week underscored continued investment in AI, security, and advanced packaging technologies.

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