• As packaging complexity rises, the industry faces gaps in data, inspection, and process integration. • Experts at the table: Semiconductor Engineering sat down to discuss back-end automation challenges in advanced packaging with Michael Lowman, senior product marketing manager for Data Analytics at Cohu; Aftkhar Aslam, CEO at yieldWerx, Woo Young Han, product marketing director at Onto Innovation; and Lihong Cao, senior director of engineering and technical marketing for ASE. • What follows are excerpts of that discussion. • L-R: Cohu’s Lowman, YieldWerx’s Aftkhar, Onto Innovation’s Han, ASE’s Cao. • SE: As advanced packaging moves toward chiplets, 3D stacks, and fine-pitch interconnects, how is back-end automation evolving? • Lowman: We make test equipment - basically test handler equipment and different aspects of the test process and finishing - and the majority of our challenges are related to thermal management.

Article Summaries:

  • As packaging complexity rises, the industry faces gaps in data, inspection, and process integration. Experts at the table: Semiconductor Engineering sat down to discuss back-end automation challenges in advanced packaging with Michael Lowman, senior product marketing manager for Data Analytics at Cohu; Aftkhar Aslam, CEO at yieldWerx, Woo Young Han, product marketing director at Onto Innovation; and Lihong Cao, senior director of engineering and technical marketing for ASE. What follows are excerpts of that discussion. L-R: Cohu’s Lowman, YieldWerx’s Aftkhar, Onto Innovation’s Han, ASE’s Cao.

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