IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program
• The research program aims to improve heat-prediction accuracy at the nanoscale while reducing simulation time for advanced semiconductor design.
Thermonat
Thermonat makes nanoscale thermal prediction practical for real-world chip design
• DARPA’s Thermonat program tackles heat management in sub‑10‑nm chips, a critical barrier to performance. • Existing commercial tools miss nanoscale heat flow; atomistic methods a