Semiconductors on Tenu Tech Brief

Caspia Technologies Unveils A Breakthrough in RTL Security Verification Paving the Way for Agentic Silicon Security

Wed, 25 Feb 2026 18:00:51 +0000

• In a significant advancement for the semiconductor industry, Caspia Technologies announced the broad availability of CODAx V2026 • 1, its flagship RTL security analyzer • The new

Designing the Future: AI-Driven Multi-Die Innovation in the Era of Agentic Engineering

Wed, 25 Feb 2026 16:00:06 +0000

• At the 2026 Chiplet Summit, Synopsys presented a bold vision for the future of semiconductor innovation: AI-driven multi-die design powered by agentic intelligence • As the semic

An Agentic Formal Verifier. Innovation in Verification

Wed, 25 Feb 2026 14:00:24 +0000

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40 PCB Design Tips Every Designer Should Know: eBook

Wed, 25 Feb 2026 08:02:05 +0000

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Back-End Automation Tackles Growing Complexity

Wed, 25 Feb 2026 08:01:53 +0000

• As packaging complexity rises, the industry faces gaps in data, inspection, and process integration. • Experts at the table: Semiconductor Engineering sat down to discuss back-en

What Designers Need to Know About UALink for Scalable AI Systems

Wed, 25 Feb 2026 08:01:50 +0000

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Blog Review: Feb. 25

Wed, 25 Feb 2026 08:01:45 +0000

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Purpose-Built Tools for Connected Design

Wed, 25 Feb 2026 08:01:34 +0000

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Survey of DL-Based LiDAR Super-Resolution For Autonomous Driving (University College London)

Wed, 25 Feb 2026 00:45:34 +0000

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Reimagining Compute in the Age of Dispersed Intelligence

Tue, 24 Feb 2026 18:00:24 +0000

• At the 2025 RISC-V Summit, amid debates over cloud scaling and AI cost, DeepComputing CEO Yuning Liang offered a radical view: the future of intelligence isn’t in the cloud at al

Three New ALD/MLD Processes for Co-organic Thin Films (Aalto University, RUB et al.)

Tue, 24 Feb 2026 16:39:48 +0000

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Siemens to Deliver Industry-Leading PCB Test Engineering Solutions

Tue, 24 Feb 2026 16:00:47 +0000

• Siemens has strengthened its position in EDA and manufacturing by acquiring ASTER Technologies, a specialist in test and reliability solutions for printed circuit boards. • The a

Agentic EDA Panel Review Suggests Promise and Near-Term Guidance

Tue, 24 Feb 2026 14:00:51 +0000

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Intel, SambaNova Planning Multi-Year Collaboration for Xeon-Based AI Inference

Tue, 24 Feb 2026 11:00:26 +0000

• As AI workloads become more diverse and complex, organizations are looking for different solutions for different needs. • This is driving demand for more heterogeneous infrastruc

Chip Industry Technical Paper Roundup: Feb. 24

Tue, 24 Feb 2026 08:01:54 +0000

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Research Bits: Feb. 24

Tue, 24 Feb 2026 08:01:46 +0000

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Chiplets 2026: Where Are We Today?

Tue, 24 Feb 2026 08:01:45 +0000

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Ultrafast Laser Filamentation Dictates Energy Deposition in Narrow-Gap Semiconductors

Tue, 24 Feb 2026 08:01:43 +0000

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ReRAM-based Neo-Hebbian Synapses For Training Neuromorphic HW (IIT Madras, UCSB)

Tue, 24 Feb 2026 00:58:46 +0000

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Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

Tue, 24 Feb 2026 00:40:14 +0000

• Cadence introduces ChipStack AI Super Agent, an agentic AI platform automating front‑end silicon design. • The Super Agent streamlines design and verification, reducing manual ef

3D Atomic-Scale Metrology of Strain Relaxation And Roughness in GAAFETs Via Electron Ptychography (Cornell, ASM, TSMC)

Mon, 23 Feb 2026 21:23:46 +0000

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Hardware is the Center of the Universe (Again)

Mon, 23 Feb 2026 18:00:13 +0000

• The 40-Year Evolution of Hardware-Assisted Verification - From In-Circuit Emulation to AI-Era Full-Stack Validation For more than a decade, Hardware-Assisted Verification platfor

Smarter ECOs: Inside Easy-Logic's ASIC Optimization Engine

Mon, 23 Feb 2026 16:00:25 +0000

• Easy-Logic Technology Ltd.is a specialized Electronic Design Automation (EDA) company focused on solving one of the most complex and time-sensitive challenges in semiconductor de

The Name Changes but the Vision Remains the Same - ESD Alliance Through the Years

Mon, 23 Feb 2026 14:00:23 +0000

• The Electronic System Design Alliance (ESDA) has been at the center of the EDA industry through its many changes over the years. • It occurred to me that an update on this organi

Backside Power Delivery Creates Fab Tool, Thermal Dissipation Barriers

Mon, 23 Feb 2026 08:01:41 +0000

• Moving the power delivery network to the backside of a chip reduces congestion, but it introduces new challenges for fabs. • Key Takeaways Backside power delivery networks delive

New Performance Requirements For Audio

Mon, 23 Feb 2026 08:01:07 +0000

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Survey of GenAI Across the Full Computing Stack, From SW To Silicon (Harvard)

Mon, 23 Feb 2026 01:12:51 +0000

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TSMC Process Simplification for Advanced Nodes

Mon, 23 Feb 2026 00:00:46 +0000

• In the modern world, the semiconductor industry stands at the heart of technological innovation. • From smartphones and laptops to advanced medical devices and artificial intelli

Accelerator Architecture: Fusion-Aware Mapper (MIT)

Sun, 22 Feb 2026 23:27:36 +0000

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Survey of GenAI Across the Full Computing Stack, From SW To Silicon (Harvard)

Sun, 22 Feb 2026 22:12:51 +0000

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CEO Interview with Juniyali Nauriyal of Photonect

Sun, 22 Feb 2026 22:00:44 +0000

• Juniyali Nauriyal is the CEO and Co-Founder of Photonect, a photonics startup focused on commercializing advanced fiber-to-chip attachment technologies. • Juniyali is the co-inve

Electrical Model of the Bitflip in SRAM Under Laser Illumination Simulating Laser Fault Injection

Sun, 22 Feb 2026 20:46:39 +0000

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Nanoscale MoS₂-based Memristors Integrated into CMOS Microchips

Fri, 20 Feb 2026 17:44:02 +0000

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What is the 3nm Pessimism Wall and Why is it An Economic Crisis?

Fri, 20 Feb 2026 16:00:52 +0000

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Discipline Will Keep Memory Market Tight

Fri, 20 Feb 2026 14:01:10 +0000

• Post‑AI market shift may constrain DRAM supply. • Manufacturers anticipate tighter inventory and pricing pressures. • Demand for high‑performance memory remains strong. • Supply

CEO Interview with Aftkhar Aslam of yieldWerx

Fri, 20 Feb 2026 14:00:57 +0000

• Aftkhar Aslam is the Co-Founder and Chief Executive Officer of yieldWerx and a semiconductor industry veteran with more than 30 years of experience spanning manufacturing, test e

Chip Industry Week in Review

Fri, 20 Feb 2026 08:02:00 +0000

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The On-Device LLM Revolution

Fri, 20 Feb 2026 08:01:56 +0000

• Why 3B to 30B models are moving to the edge - and what that means for silicon. • The AI world is experiencing a fundamental shift. • After years of cloud-centric inference domina

Intelligent Networks: Power, Reliability, and Maintenance in Telecom - Webinar Preview

Thu, 19 Feb 2026 22:00:48 +0000

• The upcoming webinar ‘Intelligent Networks: Power, Reliability, and Maintenance in Telecom’ will focus on how telecommunications networks are adapting to growing demands for effi

Custom IC Design using Additive Learning

Thu, 19 Feb 2026 18:00:06 +0000

• Custom IC design has demanding technical requirements to produce accurate simulation results for timing and power analysis in the shortest run times. • EDA vendors have been rush

LUBIS EDA: Addressing the Verification Bottleneck in Modern Chip Design

Thu, 19 Feb 2026 14:00:37 +0000

• LUBIS EDA is a Germany-based EDA company that specializes in formal verification, a mathematically rigorous method for proving that a chip design behaves correctly under all poss

Redefining Backside Metallization: Low‑Temperature Solutions For HDFO And S‑SWIFT Designs

Thu, 19 Feb 2026 08:04:17 +0000

• Efficient heat dissipation is critical in fan-out packages. • As chip performance and integration continue to advance, thermal dissipation control has become increasingly critica

Understanding Within-Wafer Variations: A Virtual Fabrication Approach

Thu, 19 Feb 2026 08:03:19 +0000

• Within-wafer variations cause performance differences across dies on a single wafer. • A virtual fabrication approach models these variations without physical wafer testing. • Se

Force Fields Will Accelerate Atomistic Simulations By 10,000× In 2026, Unlocking New Era Of Discovery

Thu, 19 Feb 2026 08:02:45 +0000

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Laser Arrays May Simplify Co-Packaged Optics

Thu, 19 Feb 2026 08:02:22 +0000

• Monolithic tunable lasers can adapt statically and dynamically. • Key Takeaways The move to co-packaged optics (CPO) holds the promise of putting photonic ICs (PICs) and electron

Leading At Light Speed: What Makes Photonics Leadership Different

Thu, 19 Feb 2026 08:01:58 +0000

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SEMI 2026 U.S. Policy Strategy

Thu, 19 Feb 2026 08:01:30 +0000

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Why Indium Oxide Chips Are Getting So Much Attention

Thu, 19 Feb 2026 08:01:27 +0000

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When Cleaning Chips Isn't Clean Enough

Thu, 19 Feb 2026 08:01:22 +0000

• Contamination is a systems-level limiter at advanced nodes, and there’s no simple solution to fix it. • Key Takeaways For much of the semiconductor industry’s history, contaminat

Enabling the Industry's First GPU-Accelerated Manufacturing Platform

Thu, 19 Feb 2026 08:01:10 +0000

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Intel Corporation to Participate in Upcoming Investor Conference

Wed, 18 Feb 2026 21:30:09 +0000

• Intel CFO will participate in a fireside chat at the Morgan Stanley Conference. • SANTA CLARA, Calif., Feb. • 18, 2025 - Intel Corporation today announced that David Zinsner, exe

New Class Of Semiconductors Made Of Germanium-Tin Alloy (University of Edinburgh et al.)

Tue, 17 Feb 2026 03:22:06 +0000

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Data Centers, Semiconductors, And Sovereignty: The Upcoming AI Divide

Thu, 12 Feb 2026 21:16:39 +0000

• What Is The AI Divide In Data Centers, Semiconductors, And Sovereignty? • TheAI dividerepresents a strategic inflection point for global business. • Those without these resources

AI + Mobile Networks: Intel Showcases What's Next at MWC 2026

Tue, 10 Feb 2026 18:00:09 +0000

• See how Intel’s proven 5G ecosystem delivers live-network AI inference on a single, open platform - maximizing infrastructure ROI today and paving a seamless path to 6G SANTA CLA

Cadence Unveils AI Agent to Accelerate Chip Design

Tue, 10 Feb 2026 15:14:56 +0000

• Cadence launches ChipStack AI Super Agent, first agentic workflow for silicon design and verification. • Claims up to 10× productivity gains, accelerating front‑end chip developm

Intel Launches new Intel® Xeon® 600 Processors for Workstation

Mon, 02 Feb 2026 21:30:24 +0000

• Up to 86 performance cores deliver unprecedented multi-threaded speed for demanding professional workloads. • 128 lanes of PCIe 5.0 connectivity enable ultra-fast data transfer f

Intel to Match Federal Contributions Under Trump Accounts Program for Employees' Families

Tue, 27 Jan 2026 22:15:23 +0000

• Intel matches $1,000 federal contribution for eligible children in 530A Trump Accounts. • Program supports U.S. employees’ families, providing tax‑deferred savings for kids under

Intel Reports Fourth-Quarter and Full-Year 2025 Financial Results

Thu, 22 Jan 2026 21:01:34 +0000

• Intel releases Q4 2025 earnings news and presentation on Investor Relations site. • Earnings call starts at 2 p.m. PDT; webcast available at www.intc.com . • CFO Dave Zinsner and

Postcard from CES 2026: Intel Launches Series 3 CPUs With 200+ Laptop Designs Coming

Thu, 08 Jan 2026 08:15:11 +0000

• Looking for a new Series 3 laptop? • You’ve come to the right place. • Earlier this week at CES 2026 in Las Vegas, Intel launched theIntel® Core™Ultra Series 3processors. • The l

Intel to Report Fourth-Quarter and Full-Year 2025 Financial Results

Wed, 07 Jan 2026 21:30:07 +0000

• Intel will deliver its report after market close on January 22. • SANTA CLARA, Calif., Jan. • 7, 2026 - Intel Corporation today announced that it will report fourth-quarter and f

Postcard from CES 2026: RoBee Steals the Spotlight with Intel® Core™ Ultra Series 3 edge processors

Wed, 07 Jan 2026 14:00:17 +0000

• Created by Oversonic Robotics - the first Italian-based robotics company that makes AI-optimized humanoid robots - RoBee was among the star attractions at Intel’s Tech Showcase a

From Building Bricks to Brilliance: Model of Intel Series 3 Processor Steals the Show

Tue, 06 Jan 2026 15:27:08 +0000

• Khoi Nguyen (left) and Zach Hill (right), with the fully-assembled 42,000-piece CPU model. • (Credit: Intel Corporation) At CES 2026 in Las Vegas, Intel surprised guests with a n

CES 2026: Intel Core Ultra Series 3 Debut as First Built on Intel 18A

Mon, 05 Jan 2026 23:03:14 +0000

• At Intel’s Series 3 launch, Intel showed off 9 engaging demos highlighting, gaming, AI, content creation, retail, edge and more - all running on PCs powered by Intel® Core™ Ultra

Theory-guided strategy expands the scope of measurable quantum interactions

Thu, 24 Jul 2025 04:00:00 +0000

• MIT proposes theory‑guided framework to measure previously invisible material properties. • Focus on electron‑phonon coupling, key to electrical, thermal, optical behavior. • Tra

Nvidia Supplier SK Hynix Posts Record Profit on AI Boom

Thu, 23 Jan 2025 02:04:00 +0000

• SK Hynix posts record quarterly profit, driven by AI chip demand. • Earnings exceed expectations in Q4 2024, boosting annual results. • Strong demand for memory chips fuels growt

Arm Launches Next-Gen Efficiency Core; Cortex-A520

Mon, 29 May 2023 00:00:16 +0000

• Cortex‑A520, Arm’s next‑gen efficient core, follows A510 with enhanced power efficiency and microarchitecture. • Codename ‘Hayes,’ it targets lowest area and cost‑constrained dev

A Look At AMD's 3D-Stacked V-Cache

Tue, 27 Dec 2022 07:30:32 +0000

• AMD’s 3D-Stacked V-Cache adds extra L3 cache via vertical stacking. • Improves gaming and compute performance by reducing memory latency. • Uses HBM2e-like interposer to connect