Chipdesign

Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

• Cadence introduces ChipStack AI Super Agent, an agentic AI platform automating front‑end silicon design. • The Super Agent streamlines design and verification, reducing manual ef

Cadence Unveils AI Agent to Accelerate Chip Design

• Cadence launches ChipStack AI Super Agent, first agentic workflow for silicon design and verification. • Claims up to 10× productivity gains, accelerating front‑end chip developm

Thermonat makes nanoscale thermal prediction practical for real-world chip design

• DARPA’s Thermonat program tackles heat management in sub‑10‑nm chips, a critical barrier to performance. • Existing commercial tools miss nanoscale heat flow; atomistic methods a