Cadence closes on Nastran, Adams, and more from Hexagon

Cadence closes on Nastran, Adams, and more from Hexagon

• The $3.18 billion acquisition of Hexagon’s design and engineering business is now complete. • You’re reading Engineering Paper, and here’s the latest design and simulation softwa

Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

• Cadence introduces ChipStack AI Super Agent, an agentic AI platform automating front‑end silicon design. • The Super Agent streamlines design and verification, reducing manual ef

Electronics & EE · February 24, 2026 (updated February 24, 2026) · 1 min · 169 words

Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

• Announced today, the new ChipStack AI Super Agent from Cadence automates front end silicon design and verification, delivering a 10X productivity increase.

Electronics & EE · February 22, 2026 (updated February 23, 2026) · 1 min · 120 words