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    <title>3Nm on Tenu Tech Brief</title>
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    <description>Recent content in 3Nm on Tenu Tech Brief</description>
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      <title>What is the 3nm Pessimism Wall and Why is it An Economic Crisis?</title>
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      <pubDate>Fri, 20 Feb 2026 16:00:52 +0000</pubDate>
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      <title>SPAD Imaging, Renesas 3nm TCAM Technology, LoRa Alliance 2025 Report: Embedded Week Insights</title>
      <link>https://cluster-site.onrender.com/posts/spad-imaging-renesas-3nm-tcam-technology-lora-alliance-2025-report-embedded-week-insights/</link>
      <pubDate>Fri, 20 Feb 2026 16:00:00 +0000</pubDate>
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      <description>• Here&amp;rsquo;s a RoundUp of this week&amp;rsquo;s must-read articles - we&amp;rsquo;ll delve into the latest developments on SPAD Imaging, Renesas 3nm TCAM Technology, and LoRa Alliance 2025 Report! • Also,</description>
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      <title>Renesas Demonstrates Configurable 3nm TCAM</title>
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      <pubDate>Thu, 19 Feb 2026 16:00:00 +0000</pubDate>
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      <description>• Renesas Electronics Corporation has announced the development of a configurable ternary content-addressable memory (TCAM) implemented using a 3 nm FinFET manufacturing process. •</description>
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      <title>Arm Launches Next-Gen Big-Core: Cortex-A725</title>
      <link>https://cluster-site.onrender.com/posts/arm-launches-next-gen-big-core-cortex-a725/</link>
      <pubDate>Wed, 29 May 2024 15:00:22 +0000</pubDate>
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      <description>• Arm unveils Cortex‑A725, the next‑gen big core succeeding the A720 in the 2024 CSS. • A725 doubles L2 cache to 1 MiB, making it the widest and deepest big core yet. • Built on 3</description>
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      <title>TSMC N3, And Challenges Ahead</title>
      <link>https://cluster-site.onrender.com/posts/tsmc-n3-and-challenges-ahead/</link>
      <pubDate>Sat, 27 May 2023 12:00:55 +0000</pubDate>
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      <description>• TSMC launches 3‑nanometer N3 process family, entering mass production in December 2022 at Fab 18. • Two main flavors: Base N3B and Enhanced N3E, treated as separate lineages with</description>
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