3-Nm | Tenu Tech Brief

Semidynamics Becomes 3-nm Ready, Moves Europe Toward Hardware Sovereignty

• Semidynamics powers Europe’s AI future with 3-nm readiness and sovereign RISC-V hardware. • The post Semidynamics Becomes 3-nm Ready, Moves Europe Toward Hardware Sovereignty app

SPAD Imaging, Renesas 3-nm TCAM Technology, LoRa Alliance 2025 Report: Embedded Week Insights

• Here’s a roundup of this week’s must-read articles. • We’ll delve into the latest developments on SPAD Imaging, Renesas 3-nm TCAM Technology, and LoRa Alliance 2025 Report! • Als

Renesas Demonstrates Configurable 3-nm TCAM

• Renesas Electronics Corporation has announced the development of a configurable ternary content-addressable memory (TCAM) implemented using a 3-nm FinFET manufacturing process. •

Renesas Advances 3-nm Automotive SoC Technologies

• Renesas Electronics Corporation has developed three system-on-chip (SoC) technologies aimed at automotive multi-domain electronic control units (ECUs), combining AI acceleration,