• Back in August last year, we wrote aboutNXP’s IW623 tri-band (2.4GHz, 5GHz, 6GHz) Wi-Fi 6E and Bluetooth LE Audio SoC, but at the time, there was no ready-to-use module based on it. • Now, NXP has partnered with Silex Technology to launch theSX-SDMAX6Emodule, available in a surface-mount LGA package or an M.2 2230 Key-E card. • The module supports Bluetooth 5.x connectivity via UART and Wi-Fi via SDIO. • It operates from a 3.3V supply with 1.8V support on the LGA version. • It has an industrial operating temperature range of -40°C to +85°C and is designed for both high-throughput applications, such as video streaming, and low-power, battery-operated devices in harsh environments. • It also supports various antenna options, fast roaming, and long-term lifecycle backing through Silex and NXP.

Article Summaries:

  • Silex Technology has announced the SX‑SDMAX6E, a ready‑to‑use module built around NXP’s IW623 tri‑band Wi‑Fi 6E (2.4 GHz, 5 GHz, 6 GHz) and Bluetooth 5.x SoC. The module is offered in a 44‑pin LGA package (17 × 18 × 2.65 mm) or an M.2 2230 Key‑E card, supporting SDIO for Wi‑Fi and UART for Bluetooth. It runs on a 3.3 V supply (1.8 V optional on LGA), operates from -40 °C to +85 °C, and is aimed at mission‑critical, low‑power or high‑throughput applications such as medical imaging, factory automation, and battery‑powered IoT devices. Silex plans to ship the module and a development board in spring 2026, with drivers optimized for NXP’s i.MX9x platform and a 10‑15 year product‑longevity guarantee.
  • Back in August last year, we wrote about NXP’s IW623 tri-band (2.4GHz, 5GHz, 6GHz) Wi-Fi 6E and Bluetooth LE Audio SoC, but at the time, there was no ready-to-use module based on it. Now, NXP has partnered with Silex Technology to launch the SX-SDMAX6E module, available in a surface-mount LGA package or an M.2 2230 Key-E card. The module supports Bluetooth 5.x connectivity via UART and Wi-Fi via SDIO. It operates from a 3.3V supply with 1.8V support on the LGA version. It has an industrial operating temperature range of -40°C to +85°C and is designed for both high-throughput applications, such

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