• θ‑phase tantalum nitride exhibits metallic behavior with thermal conductivity ~3× copper. • Synthesis achieved via high‑pressure, high‑temperature nitridation of tantalum metal in a controlled environment. • Material shows excellent stability up to 1200 °C, outperforming conventional copper conductors. • Potential applications include high‑power electronics, heat sinks, and aerospace thermal management. • Study demonstrates that phase engineering can unlock superior thermal properties in transition‑metal nitrides. • Future work aims to integrate θ‑TaN into micro‑electronic interconnects for heat dissipation.
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