• has started shipping test samples of embedded flash memory designed to comply with the UFS 5 • 0 standard, which is under development by JEDEC • 0 is engineered to meet the demanding performance needs of next-generation mobile devices, including smartphones with on-device AI capabilities • Leveraging MIPI M-PHY version 6 • 0 for its physical layer and UniPro version 3 • 0 for its protocol, UFS 5

Article Summaries:

  • Kioxia America, Inc. has started shipping test samples of embedded flash memory designed to comply with the UFS 5.0 standard, which is under development by JEDEC. UFS 5.0 is engineered to meet the demanding performance needs of next-generation mobile devices, including smartphones with on-device AI capabilities. Leveraging MIPI M-PHY version 6.0 for its physical layer and UniPro version 3.0 for its protocol, UFS 5.0 introduces HS-GEAR6 mode, enabling interface speeds of up to 46.6 Gbits/s per lane. With two lanes, this results in an effective maximum read/write performance of approximately 10.

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