• Empower Semiconductor has released three new embedded silicon capacitors (ECAPs) for AI and high-performance computing (HPC) processing. • Addressing power integrity demands as AI processors push performance higher, the ECAP portfolio delivers higher capacitance density in a small footprint. • The ECAP portfolio meets the dimensional and tolerance requirements for embedding in AI and HPC processors. • These new silicon capacitors include the EC2005P, with a 9.34-μF capacitance in a 2 × 2-mm package; the EC2025P, with a 18.68-μF capacitance in a 4 × 2-mm package; and the EC2006P, with a 36.8-μF capacitance in a 4 × 4mm form factor. • ECAP portfolio (Source: Empower Semiconductor) Featuring ultra-low equivalent series inductance (ESL) and equivalent series resistance (ESR), the ECAP portfolio’s wide bandwidth (10 MHz-10 GHz) and ultra-low impedance, needed for high performance power distribution networks, provide optimal power delivery network (PDN) performance and significantly improves overall power integrity, according to the company. • “Achieving the required power integrity for extreme current densities and ultra-fast transient response is no longer realistic with board-level mounted components; embedding capacitors into the processor substrate is now essential,” Empower said.
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