• Copy link Facebook X Whatsapp Reddit Pinterest Flipboard Email Get Tom’s Hardware’s best news and in-depth reviews, straight to your inbox • You are now subscribed Your newsletter sign-up was successful China’s leading chipmakers are working hard to increase the output of chips made using leading-edge process technologies by five times in two years to satisfy the demand of the domestic AI sector, reportsNikkei • This is going to be particularly hard to achieve given that China-based chipmakers do not have access to leading-edge tools from American, Japanese, and European companies • A deeper look at the chipmaking supply chain TSMC’s $165 billion U • investments examined China reportedly reverse-engineers EUV tool China bets on DUV, as EUV blockade reshapes chipmaking The country aims to lift production of chips using 7nm- and 5nm-class fabrication technologies from below 20,000 wafer starts per month today to roughly 100,000 within one to two years, according toNikkei • The longer-term plan includes increasing output of semiconductors produced on leading-edge nodes with an additional 500,000 wafer starts per month by 2030,Nikkeireports, citing sources familiar with the matter
Article Summaries:
- China to increase leading-edge chip output by 5x in two years, report claims - aims to lift 7nm and 5nm production to 100,000 wafers per month, targeting half a million monthly by 2030 But how? Get Tom’s Hardware’s best news and in-depth reviews, straight to your inbox. You are now subscribed Your newsletter sign-up was successful China’s leading chipmakers are working hard to increase the output of chips made using leading-edge process technologies by five times in two years to satisfy the demand of the domestic AI sector, reports Nikkei. This is going to be particularly hard to achieve given
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